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- IGBT Modules
- SEMITRANS
- SEMITRANS - Low-inductive design with 15 nH
- SEMITRANS Datasheets
- SEMITRANS Technical Explanations
- SEMITRANS Technical Articles
- SEMITRANS Press Releases
- SEMiX
- SEMiX - now with new IGBT4 chips
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SKiM 63/93
- SKiM 63/93 - 100% solder-free ensures durability
- SKiM 63/93 Datasheets
- SKiM 63/93 Technical Explanations
- SKiM 63/93 Technical Articles
- SKiM 63/93 Press Releases
- SKiM 4/5
- SKiM 4/5 - For 3-level UPS inverter
- SKiM 4/5 Datasheets
- SKiM 4/5 Technical Explanations
- SKiM 4/5 Technical Articles
- SKiM 4/5 Press Releases
- SKiiP IPM
- SKiiP IPM - for high operation temperatures
- SKiiP IPM Datasheets
- SKiiP IPM Technical Explanations
- SKiiP IPM Technical Articles
- SKiiP IPM Press Releases
- MiniSKiiP
- MiniSKiiP - Maximum power 30 kW, minimum space
- MiniSKiiP Datasheets
- MiniSKiiP Technical Explanations
- MiniSKiiP Technical Articles
- MiniSKiiP Press Releases
- MiniSKiiP IPM
- MiniSKiiP IPM - Solder-free assembly
- MiniSKiiP IPM Datasheets
- MiniSKiiP IPM Technical Explanations
- MiniSKiiP IPM Technical Articles
- MiniSKiiP IPM Press Releases
- MiniSKiiP CIB
- MiniSKiiP CIB - Converter Inverter Brake
- MiniSKiiP CIB Datasheets
- MiniSKiiP CIB Technical Explanations
- MiniSKiiP CIB Technical Articles
- MiniSKiiP CIB Press Releases
- SEMITOP
- SEMITOP - For 3-level UPS inverter
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMITOP CIB
- SEMITOP CIB - High reliability
- SEMITOP CIB Datasheets
- SEMITOP CIB Technical Explanations
- SEMITOP CIB Technical Articles
- SEMITOP CIB Press Releases
- SEMITRANS
- MOSFET Modules
- SEMITRANS
- SEMITRANS - N Channel, enhancement mode
- SEMITRANS Datasheets
- SEMITRANS Technical Explanations
- SEMITRANS Technical Articles
- SEMITRANS Press Releases
- SEMITOP
- SEMITOP - Trench-gate technology
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMITRANS
- Thyristor / Diode Modules
- SEMIPACK
- SEMIPACK - 35 years expertise
- SEMIPACK Datasheets
- SEMIPACK Technical Explanations
- SEMIPACK Technical Articles
- SEMIPACK Press Releases
- SEMIPACK Fast
- SEMIPACK Fast - Soft recovery
- SEMIPACK Fast Datasheets
- SEMIPACK Fast Technical Explanations
- SEMIPACK Fast Technical Articles
- SEMIPACK Fast Press Releases
- SEMITOP
- SEMITOP - Glass passivated thyristor chips
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMiSTART
- SEMiSTART - Thyristor with amplifying gate
- SEMiSTART Datasheets
- SEMiSTART Technical Explanations
- SEMiSTART Technical Articles
- SEMiX
- SEMiX - Chips soldered directly to isolated substrate
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMIPONT
- SEMIPONT - Integrated temperature sensor
- SEMIPONT Datasheets
- SEMIPACK
- Bridge Rectifiers
- SEMiX
- SEMiX - Terminal height 17 mm
- SEMiX Datasheets
- SEMiX Technical Explanations
- SEMiX Technical Articles
- SEMiX Press Releases
- SEMITOP
- SEMITOP - One screw mounting
- SEMITOP Datasheets
- SEMITOP Technical Explanations
- SEMITOP Technical Articles
- SEMITOP Press Releases
- SEMIPONT
- SEMIPONT - 1600V reverse voltage
- SEMIPONT Datasheets
- Power Bridge
- Power Bridge - High blocking voltage
- Power Bridge Datasheets
- Power Bridge Technical Explanations
- Miniature Leaded
- Miniature Leaded - High surge current
- Miniature Leaded Datasheets
- Miniature Leaded Technical Explanations
- Miniature Fast On
- Miniature Fast On - Easy chassis mounting
- Miniature Fast On Datasheets
- Miniature Fast On Technical Explanations
- SEMiX
- Discretes
- Leaded Diode
- Surface Mount Diode
- Surface Mount Diode - Surface Mount Diode
- Standard recovery datasheets
- Fast and ultrafast recovery datasheets
- Zener datasheets
- Schottky datasheets
- Transient voltage surpressor datasheets
- Avalanche datasheets
- Stud Diode
- Stud Diode - Stud Diode
- Standard recovery datasheets
- Fast recovery datasheets
- Avalanche datasheets
- Stud Diode Technical Explanation
- Stud Thyristor
- Stud Thyristor - Stud Thyristor
- Stud Thyristor Datasheets
- Stud Thyristor Technical Explanation
- Capsule Diode
- Capsule Diode - Low power dissipation
- Capsule Diode Datasheets
- Capsule Diode Technical Explanation
- Capsule Thyristor
- Capsule Thyristor - Hermetic metal case with glass insulator
- Capsule Thyristor Datasheets
- Capsule Thyristor Technical Explanation
- Freewheeling Diode Chips
- Freewheeling Diode Chips - freewheeling diode for IGBT
- Freewheeling Diode - CAL / CAL I3 Fast
- Freewheeling Diode - CAL I4 Fast
- Freewheeling Diode - CAL High Density
- Freewheeling Diode Chips Technical Explanations
- Thyristor Chips
- Thyristor Chips - controlled rectifier circuits
- Thyristor Chips Datasheets
- Thyristor Chips Technical Explanations
- Rectifier Chips
- Rectifier Chips - uncontrolled rectifier bridges
- Rectifier Chips Datasheets
- Rectifier Chips Technical Explanations
- Drivers
- Accessories
- Heat Sink
- Heat Sink - Designed for natural or forced air cooling
- Heat Sink Datasheets
- Fans
- Fans - Low noise level
- Fans Datasheets
- Fuses
- Fuses - total height H = 38 ,5 mm
- Fuses Datasheets
- Heat Sink
- IGBT Modules
SKiiP 4 IPM
- Sintered chips - for high operation temperatures
Mechanically compatible to SKiiP®3
33% more power, same volume
Reliability
5 x higher temperature cycling
Benefits of SKiiP®4 driver
- Digital signal transmission for high signal integrity and noise immunity
- All switching and sensor signals are galvanically insulated
- Diagnose channel (CAN open protocol)
- Multi-output stage for soft switching behaviour and low over-voltage
SKiiP
4th generation
Intelligent Power Module: IPM
Melting temp. is 6 x higher than operating temperatures
- 3 in 1: Driver, semiconductor, cooling
- 400 kW - 1,8 MW
- 33% more power, same volume
- 5 x higher thermal cycling capability
- Sintered chips - for high operation temperatures
- 3 in 1: Driver, semiconductor, cooling
- 400 kW - 1,8 MW
- 33% more power, same volume
- 5 x higher thermal cycling capability
- Sintered chips - for high operation temperatures
Melting temp. is 6 x higher than operating temperatures
Datasheets
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